A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnects

Lofrano, MelinaMelinaLofranoWilson, ChrisChrisWilsonCroes, KristofKristofCroes2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21051A calibrated FEM study of the influence of line width, line spacing and dielectric E modulus on stress and stress gradients in BEOL copper interconnectsMeeting abstract