Hiblot, GaspardGaspardHiblotVan Huylenbroeck, StefaanStefaanVan HuylenbroeckVan der Plas, GeertGeertVan der PlasDe Wachter, BartBartDe WachterVaisman Chasin, AdrianAdrianVaisman ChasinKaczer, BenBenKaczerChiarella, ThomasThomasChiarellaMitard, JeromeJeromeMitardDemuynck, StevenStevenDemuynckBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30895Impact of 1 $lm TSV via-last integration on electrical performance of advanced FinFET devicesProceedings paper