A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

Lofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalezVandevelde, BartBartVandevelde2021-10-222021-10-2220140167-9317https://imec-publications.be/handle/20.500.12860/24162A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structuresJournal articlehttp://www.sciencedirect.com/science/article/pii/S016793171300693X