Dry etch damage in n-type crystalline silicon wafers assessed by Deep-Level Transient Spectroscopy

Simoen, EddyEddySimoenSivaramakrishnan Radhakrishnan, HariharsudanHariharsudanSivaramakrishnan RadhakrishnanUddin, MD GiusMD GiusUddinGordon, IvanIvanGordonPoortmans, JefJefPoortmansWang, ChongChongWangLi, WeiWeiLi2021-10-262021-10-2620181071-1023https://imec-publications.be/handle/20.500.12860/31789Dry etch damage in n-type crystalline silicon wafers assessed by Deep-Level Transient SpectroscopyJournal article