Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials

Cadacio Jr., FranciscoFranciscoCadacio Jr.Rebibis, Kenneth JuneKenneth JuneRebibisCapuz, GiovanniGiovanniCapuzDaily, RobertRobertDailyGerets, CarineCarineGeretsDuval, FabriceFabriceDuvalWang, TengTengWangMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23597Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materialsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7028355