High-density electrical recording and impedance imaging with a multi-modal CMOS multi-electrode array chip

Miccoli, BeatriceBeatriceMiccoliMora Lopez, CarolinaCarolinaMora LopezGoikoetxea, ErkudenErkudenGoikoetxeaPutzeys, JanJanPutzeysSekeri, MakrinaMakrinaSekeriKrylychkina, OlgaOlgaKrylychkinaChang, Shuo-WenShuo-WenChangFirrincieli, AndreaAndreaFirrincieliAndrei, AlexandruAlexandruAndreiReumers, VeerleVeerleReumersBraeken, DriesDriesBraeken2021-10-272021-10-2720191662-453Xhttps://imec-publications.be/handle/20.500.12860/33585High-density electrical recording and impedance imaging with a multi-modal CMOS multi-electrode array chipJournal articlehttps://doi.org/10.3389/fnins.2019.00641