Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down

Phommahaxay, AlainAlainPhommahaxayVerbinnen, GreetGreetVerbinnenSuhard, SamuelSamuelSuhardBex, PieterPieterBexVan den Eede, AxelAxelVan den EedePancken, JorisJorisPanckenLismont, MarkMarkLismontJourdain, AnneAnneJourdainWoitke, TobiasTobiasWoitkeBisson, PeterPeterBissonSpiess, WalterWalterSpiessSwinnen, BartBartSwinnenBeyer, GeraldGeraldBeyerMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21304Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track downProceedings paper