Fast and accurate modeling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements

Rack, MartinMartinRackRaskin, J.P.J.P.RaskinSun, XiaoXiaoSunVan der Plas, GeertGeertVan der PlasAbsil, PhilippePhilippeAbsilBeyne, EricEricBeyne2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27176Fast and accurate modeling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurementsProceedings paperhttp://ieeexplore.ieee.org/document/7545543/?arnumber=7545543