New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding

De Messemaeker, JokeJokeDe MessemaekerWitters, LiesbethLiesbethWittersZhang, BoyaoBoyaoZhangTsau, ThomasThomasTsauFodor, FerencFerencFodorDe Vos, JoeriJoeriDe VosBeyer, GeraldGeraldBeyerCroes, KristofKristofCroesBeyne, EricEricBeyne2024-06-042023-10-242024-06-0420230569-5503WOS:001047624100020https://imec-publications.be/handle/20.500.12860/42944New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer BondingProceedings paper10.1109/ECTC51909.2023.00027979-8-3503-3498-2WOS:001047624100020