Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging concepts

Oprins, HermanHermanOprinsBadaroglu, MustafaMustafaBadarogluVandevelde, BartBartVandeveldeGonzalez, MarioMarioGonzalezVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-212021-10-212013-05https://imec-publications.be/handle/20.500.12860/22891Numerical comparison of the thermal performance of 3D stacking and Si interposer based packaging conceptsProceedings paper