Development of compression molding process for Fan-Out wafer level packaging

Bertheau, JulienJulienBertheauDuval, FabriceFabriceDuvalKubota, TadashiTadashiKubotaBex, PieterPieterBexKennes, KoenKoenKennesPhommahaxay, AlainAlainPhommahaxayPodpod, ArnitaArnitaPodpodBeyne, EricEricBeyneMiller, AndyAndyMillerBeyer, GeraldGeraldBeyer2021-12-162021-11-022021-12-1620200569-5503WOS:000620983200293https://imec-publications.be/handle/20.500.12860/38150Development of compression molding process for Fan-Out wafer level packagingProceedings paper10.1109/ECTC32862.2020.00306978-1-7281-6180-8WOS:000620983200293