Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanStucchi, MicheleMicheleStucchiVandevelde, BartBartVandeveldeVan der Plas, GeertGeertVan der PlasMarchal, PolPolMarchalBeyne, EricEricBeyne2021-10-192021-10-192011-03https://imec-publications.be/handle/20.500.12860/19519Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chipsProceedings paper