Process challenges during CVD oxide deposition on the backside of 20-Î¼m thin 300-mm wafers temporarily bonded to glass carriers.

Kennes, KoenKoenKennesGuerrero, AliceAliceGuerreroSalahouelhadj, AbdellahAbdellahSalahouelhadjSuhard, SamuelSamuelSuhardDerakhshandeh, JaberJaberDerakhshandehPhommahaxay, AlainAlainPhommahaxayBrems, StevenStevenBremsBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2023-12-182023-10-242023-12-1820230569-5503WOS:001047624100259https://imec-publications.be/handle/20.500.12860/42946Process challenges during CVD oxide deposition on the backside of 20-Î¼m thin 300-mm wafers temporarily bonded to glass carriers.Proceedings paper10.1109/ECTC51909.2023.00269979-8-3503-3498-2WOS:001047624100259