Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies

Vanfleteren, JanJanVanfleterenDe Baets, JohanJohanDe BaetsVan Calster, AndreAndreVan CalsterSchols, G.G.ScholsPergoot, N.N.PergootJärvinen, E.E.JärvinenAintila, A.A.Aintila2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3971Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologiesProceedings paper