Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies

Vandevelde, BartBartVandeveldeBeyne, EricEricBeyneVandepitte, D.D.VandepitteBaelmans, M.M.Baelmans2021-10-152021-10-152004-09https://imec-publications.be/handle/20.500.12860/9828Analytical thermo-mechanical model for non-underfilled area array flip chip assembliesJournal article