Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process

Daily, RobertRobertDailyCapuz, GiovanniGiovanniCapuzMiller, AndyAndyMillerBex, PieterPieterBexRebibis, Kenneth JuneKenneth JuneRebibis2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20518Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking processMeeting abstract