Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging

Malainou, AntoniaAntoniaMalainouSabuncuoglu Tezcan, DenizDenizSabuncuoglu Tezcan2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33518Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packagingProceedings paper