ESD consideration on 3D stacking integrated circuits constructed with through-silicon-via (TSV) and micro-bump structures

Linten, DimitriDimitriLintenChen, Shih-HungShih-HungChen2021-10-202021-10-202012-07https://imec-publications.be/handle/20.500.12860/21035ESD consideration on 3D stacking integrated circuits constructed with through-silicon-via (TSV) and micro-bump structuresMeeting abstract