Miller, AndyAndyMillerRebibis, Kenneth JuneKenneth JuneRebibisDuval, FabriceFabriceDuvalWang, TengTengWangSlabbekoorn, JohnJohnSlabbekoornDe Vos, JoeriJoeriDe VosBeyne, EricEricBeyne2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27013The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyondProceedings paper