Wet clean in BEOL interconnect: Post etch residue removal and material compatibility

Kesters, ElsElsKestersLe, Quoc ToanQuoc ToanLeYu, DavidDavidYuShen, MaryMaryShenBraun, SimonSimonBraunKlipp, AndreasAndreasKlippHolsteyns, FrankFrankHolsteyns2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24052Wet clean in BEOL interconnect: Post etch residue removal and material compatibilityProceedings paperUltra Clean Processing of Semiconductor Surfaces