Implications of the use of FPGAs in bare die form for high density packaging applications

Truzzi, ClaudioClaudioTruzziBeyne, EricEricBeyne2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3896Implications of the use of FPGAs in bare die form for high density packaging applicationsProceedings paper