Richard, EmmanuelEmmanuelRichardVervoort, IwanIwanVervoortBrongersma, SywertSywertBrongersmaBeyer, GeraldGeraldBeyerBender, HugoHugoBenderPalmans, RogerRogerPalmansLagrange, SébastienSébastienLagrangeMaex, KarenKarenMaex2021-10-142021-10-141999https://imec-publications.be/handle/20.500.12860/3774Roles of additive during filling process of damascene structures with electrochemical deposited copperOral presentation