Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations

Spessot, AlessioAlessioSpessotSalahuddin, Shairfe MuhammadShairfe MuhammadSalahuddinEscobar Gavilanez, RicardoRicardoEscobar GavilanezRitzenthaler, RomainRomainRitzenthalerXiang, YangYangXiangBudhwani, Rahul KumarRahul KumarBudhwaniDentoni Litta, EugenioEugenioDentoni LittaCapogreco, ElenaElenaCapogrecoBastos, JoaoJoaoBastosChen, YangyinYangyinChenHoriguchi, NaotoNaotoHoriguchi2023-06-132022-10-302023-06-1320222330-7978WOS:000869001800038https://imec-publications.be/handle/20.500.12860/40643Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generationsProceedings paper10.1109/IMW52921.2022.9779308978-1-6654-9947-7WOS:000869001800038MEMORY