Mechanical and thermo-mechanical behavior of electroplated Copper Through Silicon Vias

Vanstreels, KrisKrisVanstreelsOkoro, ChukwudiChukwudiOkoroLabie, RietRietLabie2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/18242Mechanical and thermo-mechanical behavior of electroplated Copper Through Silicon ViasMeeting abstract