Outperformance of Cu pillar flip chip bumps in electromigration testing

Labie, RietRietLabieDosseul, FranckFranckDosseulWebers, TomasTomasWebersWinters, ChristopheChristopheWintersCherman, VladimirVladimirChermanBeyne, EricEricBeyneVandevelde, BartBartVandevelde2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19229Outperformance of Cu pillar flip chip bumps in electromigration testingProceedings paper