Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology

Kumar, NitishNitishKumarChen, YukaiYukaiChenSankatali, VenkateswarluVenkateswarluSankataliMishra, SubratSubratMishraGupta, AnkurAnkurGuptaSingh, PushpaprajPushpaprajSinghCatthoor, FranckyFranckyCatthoorMyers, JamesJamesMyersRyckaert, JulienJulienRyckaertBiswas, DwaipayanDwaipayanBiswas2025-04-102025-02-022025-04-102024979-8-3503-8814-51930-8833WOS:001349548800085https://imec-publications.be/handle/20.500.12860/45144Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet TechnologyProceedings paper10.1109/ESSERC62670.2024.10719443979-8-3503-8813-8WOS:001349548800085