Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

Wong, C.S.C.S.WongIvankovic, AndrejAndrejIvankovicCowley, A.A.CowleyBennett, N.S.N.S.BennettDanilewsky, A.A.DanilewskyGonzalez, MarioMarioGonzalezCherman, VladimirVladimirChermanVandevelde, BartBartVandeveldeDe Wolf, IngridIngridDe WolfMcNally, P.J.P.J.McNally2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24829Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chipsProceedings paperhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6897495&tag=1