Tokei, ZsoltZsoltTokeiSutcliffe, VictorVictorSutcliffeDemuynck, StevenStevenDemuynckIacopi, FrancescaFrancescaIacopiRoussel, PhilippePhilippeRousselBeyer, GeraldGeraldBeyerHoofman, RomanoRomanoHoofmanMaex, KarenKarenMaex2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9686Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnectsProceedings paper