Guest editorial: Special issue on testing of 3D stacked integrated circuits

Marinissen, Erik JanErik JanMarinissenZorian, YervantYervantZorian2021-10-202021-10-202012-020923-8174https://imec-publications.be/handle/20.500.12860/21107Guest editorial: Special issue on testing of 3D stacked integrated circuitsJournal articlehttp://dx.doi.org/10.1007/s10836-012-5279-2