Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling

Derakhshandeh, JaberJaberDerakhshandehBeyne, EricEricBeyneCapuz, GiovanniGiovanniCapuzInoue, FumihiroFumihiroInoueCherman, VladimirVladimirChermanDe Preter, IngeIngeDe PreterDuval, FabriceFabriceDuvalSlabbekoorn, JohnJohnSlabbekoornGerets, CarineCarineGeretsHeyvaert, CindyCindyHeyvaertBeirnaert, FilipFilipBeirnaertCochet, TomTomCochetBex, PieterPieterBexHou, LinLinHouLofrano, MelinaMelinaLofranoJamieson, GeraldineGeraldineJamiesonHeylen, NancyNancyHeylenSuhard, SamuelSamuelSuhardHonore, MiaMiaHonoreWebers, TomasTomasWebersRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyer2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/32872Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scalingProceedings paperhttps://ieeexplore.ieee.org/document/8951856