Katti, GuruprasadGuruprasadKattiMercha, AbdelkarimAbdelkarimMerchaStucchi, MicheleMicheleStucchiTokei, ZsoltZsoltTokeiVelenis, DimitriosDimitriosVelenisVan Olmen, JanJanVan OlmenHuyghebaert, CedricCedricHuyghebaertJourdain, AnneAnneJourdainRakowski, MichalMichalRakowskiDebusschere, IngridIngridDebusschereSoussan, PhilippePhilippeSoussanOprins, HermanHermanOprinsDehaene, WimWimDehaeneDe Meyer, KristinKristinDe MeyerTravaly, YoussefYoussefTravalyBeyne, EricEricBeyneBiesemans, SergeSergeBiesemansSwinnen, BartBartSwinnen2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17353Temperature dependent electrical characteristics of through-si-via (TSV) interconnectionsProceedings paper