Hou, LinLinHouDerakhshandeh, JaberJaberDerakhshandehCapuz, GiovanniGiovanniCapuzLofrano, MelinaMelinaLofranoBeyne, EricEricBeyneMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerDe Wolf, IngridIngridDe Wolf2021-10-282021-10-282020https://imec-publications.be/handle/20.500.12860/35285A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stackingProceedings paperhttps://ieeexplore.ieee.org/document/9159326