Green mold compounds: impact on second level interconnect reliability

Vandevelde, BartBartVandeveldeLofrano, MelinaMelinaLofranoWillems, GeertGeertWillems2021-10-192021-10-192011-12https://imec-publications.be/handle/20.500.12860/20021Green mold compounds: impact on second level interconnect reliabilityProceedings paper