TSV Cu plating and implications for CMP

Radisic, AlexAlexRadisicPhilipsen, HaroldHaroldPhilipsenHonore, MiaMiaHonoreWang, Yu-ShuenYu-ShuenWangHeylen, NancyNancyHeylenEl-Mekki, ZaidZaidEl-MekkiArmini, SilviaSilviaArminiVandersmissen, KevinKevinVandersmissenRodet, SimonSimonRodetVan Ammel, AnnemieAnnemieVan AmmelBender, HugoHugoBenderDrijbooms, ChrisChrisDrijboomsVanstreels, KrisKrisVanstreelsRuythooren, WouterWouterRuythooren2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17866TSV Cu plating and implications for CMPMeeting abstracthttp://ecsmeet3.peerx-press.org/ms_files/ecsmeet3/2010/05/03/00000660/00/660_0_art_0_l1q2l3.pdf