0-Level packaging techniques for flip-chip mounted MMICs

De Raedt, WalterWalterDe RaedtBrebels, StevenStevenBrebelsMonfraix, P.P.MonfraixCarchon, GeertGeertCarchonJourdain, AnneAnneJourdainTilmans, HarrieHarrieTilmans2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/52010-Level packaging techniques for flip-chip mounted MMICsProceedings paper