Cost-effectiveness of wafer-to-wafer 3D chip stacking with matching pre-tested wafers

Verbree, JoukeJoukeVerbreeMarinissen, Erik JanErik JanMarinissenRoussel, PhilippePhilippeRousselVelenis, DimitriosDimitriosVelenis2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/18255Cost-effectiveness of wafer-to-wafer 3D chip stacking with matching pre-tested wafersOral presentationhttp://www.date-conference.com/files/file/10-workshops/date10-3dws-digestv2-100330.pdf