Soulie, Jean-PhilippeJean-PhilippeSoulieSankaran, KiroubanandKiroubanandSankaranFounta, ValeriaValeriaFountaOpsomer, KarlKarlOpsomerDetavernier, ChristopheChristopheDetavernierVan de Vondel, JorisJorisVan de VondelPourtois, GeoffreyGeoffreyPourtoisTokei, ZsoltZsoltTokeiSwerts, JohanJohanSwertsAdelmann, ChristophChristophAdelmann2024-08-292024-03-292024-08-2920240167-9317WOS:001174447600001https://imec-publications.be/handle/20.500.12860/43744Al3Sc thin films for advanced interconnect applicationsJournal article10.1016/j.mee.2024.112141WOS:001174447600001INTERMETALLIC COMPOUNDSRESISTIVITY