Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits

Okudur, Oguzhan OrkutOguzhan OrkutOkudurDe Messemaeker, JokeJokeDe MessemaekerSalahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezZahedmanesh, HoumanHoumanZahedmaneshVarela Pedreira, OlallaOlallaVarela PedreiraKim, Soon-WookSoon-WookKimVanstreels, KrisKrisVanstreelsBeyne, EricEricBeyneDe Wolf, IngridIngridDe Wolf2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/29105Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuitsMeeting abstract