Reliability of different flex materials in high density flip chip on flex applications

Palm, P.P.PalmMäättänen, J.J.MäättänenDe Maquillé, Y.Y.De MaquilléPicault, A.A.PicaultVanfleteren, JanJanVanfleterenVandecasteele, BjornBjornVandecasteele2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5560Reliability of different flex materials in high density flip chip on flex applicationsProceedings paper