Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers

Bruynseraede, ChristopheChristopheBruynseraedeFisher, A.H.A.H.FisherUngar, F.F.UngarSchuhmacher, JorgJorgSchuhmacherSutcliffe, VictorVictorSutcliffeMichelon, JulienJulienMichelonMaex, KarenKarenMaex2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/8645Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriersProceedings paper