Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments

Iwasaki, AkihisaAkihisaIwasakiAkanishi, YuyaYuyaAkanishiMatsumoto, FulvioFulvioMatsumotoKesters, ElsElsKestersLe, Quoc ToanQuoc ToanLeHolsteyns, FrankFrankHolsteyns2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28574Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatmentsMeeting abstracthttp://ma.ecsdl.org/content/MA2017-02/24/1079.abstract