Process complexity and cost considerations of multi-layer die stacks

Velenis, DimitriosDimitriosVelenisDe Vos, JoeriJoeriDe VosKim, Soon-WookSoon-WookKimDerakhshandeh, JaberJaberDerakhshandehBex, PieterPieterBexCapuz, GiovanniGiovanniCapuzSuhard, SamuelSamuelSuhardRebibis, Kenneth JuneKenneth JuneRebibisVan Huylenbroeck, StefaanStefaanVan HuylenbroeckMarinissen, Erik JanErik JanMarinissenPhommahaxay, AlainAlainPhommahaxayMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34340Process complexity and cost considerations of multi-layer die stacksProceedings paperhttps://3dic-conf.org/wp-content/uploads/2019/09/3DIC_Program_Schedule_20190904.pdf