Vandevelde, BartBartVandeveldeDegrendele, LievenLievenDegrendeleCauwe, MaartenMaartenCauweAllaert, BartBartAllaertLauwaert, RalphRalphLauwaertWillems, GeertGeertWillems2021-10-232021-10-232016-04https://imec-publications.be/handle/20.500.12860/27485How the mold compound thermal expansion overrules the solder composition choice in board level reliability performanceProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7486790