An investigation of thermo-mechanical stress in IC's induced during chip assembly

Lofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalezCherman, VladimirVladimirChermanBeyne, EricEricBeyne2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/31223An investigation of thermo-mechanical stress in IC's induced during chip assemblyMeeting abstract