3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond

Hu, Yu-HsiangYu-HsiangHuRebibis, Kenneth JuneKenneth JuneRebibisZhao, MingMingZhaoLa Manna, AntonioAntonioLa MannaBeyne, EricEricBeyneLiu, C.S.C.S.LiuLii, M.J.M.J.LiiYu, C.H.C.H.Yu2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/208303D stacking using Cu-Cu direct bonding for 40μm pitch and beyondProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6542096&queryText%3D3D+stacking+using+Cu-Cu+direct+bonding+for+40