A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

Saleh, AhmedAhmedSalehCroes, KristofKristofCroesCeric, H.H.CericDe Wolf, IngridIngridDe WolfZahedmanesh, HoumanHoumanZahedmanesh2023-11-282023-11-122023-11-2820230021-8979WOS:001089501700006https://imec-publications.be/handle/20.500.12860/43138A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliabilityJournal article10.1063/5.0165949WOS:001089501700006MECHANICAL-STRESSMODELLINESFAILURECOPPERGROWTH