On the impact of reduced thermal budget on HfO2 electron trap and SiO2 hole trap defect bands in RMG gate stacks for sequential 3D CMOS integration

Franco, JacopoJacopoFrancoWu, ZhichengZhichengWuClaes, DieterDieterClaesVandooren, AnneAnneVandoorenHoriguchi, NaotoNaotoHoriguchiLinten, DimitriDimitriLintenGrasser, TiborTiborGrasserKaczer, BenBenKaczer2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/32976On the impact of reduced thermal budget on HfO2 electron trap and SiO2 hole trap defect bands in RMG gate stacks for sequential 3D CMOS integrationMeeting abstracthttps://www.ieeesisc.org/programs/2019_SISC_technical_program.pdf