Cryogenic etching processes applied to porous low-k materials using C4F8/SF6 plasmas

Leroy, F.F.LeroyZhang, LipingLipingZhangTillocher, T.T.TillocherYatsuda, K.K.YatsudaMaekawa, KKMaekawaNishimura, EENishimuraLefaucheux, PPLefaucheuxde Marneffe, Jean-FrancoisJean-Francoisde MarneffeBaklanov, MikhaïlMikhaïlBaklanovDussart, RRDussart2021-10-222021-10-2220150022-3727https://imec-publications.be/handle/20.500.12860/25531Cryogenic etching processes applied to porous low-k materials using C4F8/SF6 plasmasJournal articlehttp://iopscience.iop.org/article/10.1088/0022-3727/48/43/435202;jsessionid=F796BFA7BEDDB443951586DEF11045CB.c1