Optimization methods for post-bond die-internal/external testing in 3D stacked ICs

Noia, BrandonBrandonNoiaChakrabarty, KrishnenduKrishnenduChakrabartyMarinissen, Erik JanErik JanMarinissen2021-10-182021-10-182010-10https://imec-publications.be/handle/20.500.12860/17705Optimization methods for post-bond die-internal/external testing in 3D stacked ICsProceedings paper