Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment

Jonckheere, RikRikJonckheerePhilipsen, VickyVickyPhilipsenScheuring, GerdGerdScheuringHillman, FrankFrankHillmanBrueck, Hans-JuergenHans-JuergenBrueckOrdynskyy, VolodymyrVolodymyrOrdynskyyPeter, KaiKaiPeterHourd, AndrewAndrewHourdSchaetz, ThomasThomasSchaetzChen, Shiuh-BinShiuh-BinChenChen, ParksonParksonChenSommer, KarlKarlSommer2021-10-152021-10-152003-01https://imec-publications.be/handle/20.500.12860/7704Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environmentProceedings paper